Koch-Chemie - Micro Cut Pad V2 - Special Sponge for Removing Fine Scratches, Holograms, and Polishing Marks; High Stability; Long-Lasting Compression Hardness; Contours Easily (126mm x 23mm) (Hard)

High-quality foam sponge for removing fine scratches, holograms, and polishing marks using the Micro Cut M3.02 and Micro Cut & Finish P3.01.

The short 23mm height creates low torsion forces, very good handling, and the highest level of stability; and the dense foam material enables long-lasting compression hardness during polishing.

The optimized reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors.

The milling edge ensures extra flexibility for the pads, enabling them to fit around contours more easily.

EXCELLENCE FOR EXPERTS -Since 1968, Koch‑Chemie stands for high-quality cleaning and care products in the fields of washing chemistry, vehicle preparation, workshops, and industry.

Koch-Chemie's MICRO CUT (Purple) PAD is a high-quality special sponge for removing fine scratches, holograms, and polishing marks using Koch-Chemie's MICRO CUT M3.02 and/or MICRO CUT & FINISH P3.01 Polishing Compounds. The short height of 23mm creates low torsion forces, very good handling, and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing. The optimized reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours more easily. The colorful non-woven material, suitable for polishing, ensures process safety. Compression hardness: 10. Abrasiveness: 5. Notice: This product information can advise you only without obligation. Liability on our part can not be derived. Please check whether the product is suitable for your application. We will be pleased to assist you.